Laser machining and micro-machining
Laser machining or laser micro-machining enables the production of very high-precision parts, with micrometer-scale tolerances. It is used for cutting, drilling, controlled engraving, selective ablation, and micro-turning operations.
This technology represents a high-performance alternative to traditional micro-fabrication processing such as chemical machining (which generates solvents), mechanical machining (which produces chips), and electrical discharge machining (EDM)n which requires consumables.
Achieve feature sizes range from the millimeter to the micrometer scale, with tolerance on the order of a few micrometers, depending on the process used. All pulse durations are applicable (except attosecond pulses), as well as wavelengths ranging from infrared to ultraviolet.
Each laser micro-machining process has its own technical specificities.
Laser turning
- Machining of biocompatible materials
- Surface functionalization
- Minimun achievable diameter 70 µm
- Surface roughness < 0.02
- Elimination of tribo-finishing processes
Cutting and micro-cutting
- No thermal effects
- Cutting of thin films and very hard materials (diamond, SiC)
- High precision and repeatable tolerances
- Sidewall roughness < 100 nm
Drilling and micro-drilling
- Controlled depth and geometry
- Diameter < 10 µm
- Aspect ratio > 15
- Sidewall roughness < 100 nm
Controlled engraving
Layer-by-layer material removal
- Micron-level controlled engraving
- 2D and 3D part machining
- Engraving bottom surface roughness down to 500 nm
Selective ablation
Ablation of a surface layer without damaging the substrate
- No damage to the substrate or conductive layers
- Machining of layers only a few nm thick
- Little to no dust or delamination
- Process speed on the order of s/cm2
Datasheet
Any questions?
Contact-us
