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Machining of transparent materials

Cutting, welding, drilling and engraving of transparent materials with minimization of mechanical stress. Short or ultra-short pulse lasers allow transparent materials to be machined with or without removal of material and to modify their intra-volume physical properties.

The characteristics of the machining of transparent materials process:

Benefits machining of transparent materials


  • Intra-volume machining: localized laser modification – long lasting effect - no need for additional organic layer
  • Ablation-free cutting: dust-free - very fast - no taper
  • Conventional cutting: fast - with controlled geometry
Performance machining of transparent materials


  • Intra-volume machining: up to 15 MPa of mechanical strength for some glasses, micrometric precision
  • Conventional and ablation-free cutting: precision of a few μm
  • Conventional cutting: aspect ratio up to 50
Throughput machining of transparent materials


  • Ablation-free cutting: > 100 mm.s-1, can cut up to a thickness of 1 mm in a single pass
  • Intra-volume machining: <100 mm.s-1 for welding and a few hundred mm.s-1 for index modification
  • Conventional cutting: up to a few tens of mm.s-1 of machining speed depending on the thickness
Laser workstation - machining of transparent materials

Laser workstation

  • Intra-volume machining: large numerical aperture objective, scanning systems
  • Ablation-free cutting: special beam shaping such as Bessel beam
  • Conventional cutting: bottom-up approach through material volume
Surface condition machining of transparent materials

Surface condition

  • Ablation-free cutting: surface roughness less than 500 nm
  • Conventional cutting: surface roughness less than 1 μm


Materials used for the machining of transparents materials:

  • Glass
  • Crystals
  • Transparents ceramics
Machining of transparent materials

Areas of application

  • Watchmaking
  • Optics
  • Display
  • Electronics


Associated products or services