Laser drilling makes it possible to create through or blind holes with variable shape and high aspect ratio, on all types of materials and thicknesses.
The characteristics of laser drilling:
- Diameter <10 μm
- Adaptable shape
- Aspect ratio >15
- Drilling transparent materials
- Cylindrical drilling
- Tolerances of a few μm
- Accuracy of a few μm
- Depth and geometry control
- Dependant on material thickness
- From ms to s per hole
- Pulse duration from fs to ms
- Trepanning head
- Drilling head
- Scanning systems
- Wavelength from IR to UV
Roughness of a few hundreds of nm on the hole inner surface
Areas of application
- Diamond spinneret manufacturing
Associated products or services
Selective ablationThe use of a specific pulse duration and/or suitable wavelength(s) makes it possible to work in a condition where the surface layer ablation threshold is lower than the substrate’s.
Etching - Controlled ablationLaser engraving is carried out by removing material layer by layer to obtain a 2D or 3D effect on all material types.
Laser shock peeningShock waves (> GPa) applied to metallic materials improve their fatigue resistance and their resistance to corrosion.
Machining of transparent materialsCutting, welding, drilling and engraving of transparent materials with minimization of mechanical stress. Short or ultra-short pulse lasers allow transparent materials to be machined with or without removal of material and to modify their intra-volume physical properties.
Laser cuttingLaser cutting enables precision part production of all material types, even of transparent and hard materials such as SIC and diamond.
Surface texturingLaser texturing and surface functionalization make it possible to create effects or generate new properties on all surface types.
Intra-volume markingIntra-volume laser marking makes it possible to locally modify the refractive index of transparent materials. This modification allows you to inscribe 3D patterns to functionalize or to create a decorative effect in the material.