Laser drilling allows you to obtain holes of variable geometry with a large aspect ratio, blind hole or not, on all types of materials and all thicknesses.
The characteristics of laser drilling:
- Diameter < 10 μm
- Adaptable geometry
- Aspect ratio > 15
- Drilling of transparent materials
- Cylindrical drilling
- Tolerances of a few μm
- Precision of a few μm
- Geometry and depth control
- Depending on the thickness of the material
- From ms to s by hole
- Pulse duration from fs to ms
- Trepanning head
- Drilling head
- Wavelength from IR to UV
Sidewalls roughness of the order of a few hundreds of nm
- Diamond die
Associated products or services
Laser shock peeningThe laser shock peening process improves fatigue and corrosion resistance through the use of shock waves greater than GPa on metallic materials.
Machining of transparent materialsThe machining of transparent materials consists in cutting, welding, drilling and engraving by minimising mechanical stresses.
Laser cuttingLaser cutting allows the manufacture of precision parts from all types of materials, even transparent and hard, like silicon carbide or diamond.
Surface texturingSurface functionalisation or texturing by laser allows you to create effects or give new properties to all types of materials, according to the desired function.
Intra-volume markingIntra-volume marking by laser allows very local modification of the refractive index in transparent materials. This modification allows registration of patterns in 3D to functionalise or create a decorative effect in the material.