Laser engraving is carried out by removing material layer by layer to obtain a 2D or 3D effect on all material types.
The characteristics of the etching - controlled ablation process:
- Controlled ablation up to a few μm depth
- 3D part machining
- Roughness less than a few μm
- Tolerance of a few μm
- Accuracy of a few μm
Variable depending on the material and the pulse duration: on the order of a few mm3.min-1
- IR, green or UV laser
- Femtosecond to nanoscale pulse
- Scanning systems
Final surface roughness up to 0.5 μm
Areas of application
- Texturing of injection moulds
- Stamping tools
Associated products or services
Selective ablationThe use of a specific pulse duration and/or suitable wavelength(s) makes it possible to work in a condition where the surface layer ablation threshold is lower than the substrate’s.
Laser shock peeningShock waves (> GPa) applied to metallic materials improve their fatigue resistance and their resistance to corrosion.
Machining of transparent materialsCutting, welding, drilling and engraving of transparent materials with minimization of mechanical stress. Short or ultra-short pulse lasers allow transparent materials to be machined with or without removal of material and to modify their intra-volume physical properties.
Laser drillingLaser drilling makes it possible to create through or blind holes with variable shape and high aspect ratio, on all types of materials and thicknesses.
Laser cuttingLaser cutting enables precision part production of all material types, even of transparent and hard materials such as SIC and diamond.
Surface texturingLaser texturing and surface functionalization make it possible to create effects or generate new properties on all surface types.