The use of a specific pulse duration and/or suitable wavelength(s) makes it possible to work in a condition where the surface layer ablation threshold is lower than the substrate’s.
The characteristics of the selective ablation process:
- No damage to the substrate
- No delamination
- No dust
- Ablation over a few μm
- Nanoscale layer ablation
- Control of layer ablation depth
- Tolerance of a few μm
- Accuracy of a few μm
- Resolution of a few μm
Up to a few m.s-1 or around s.cm-2
- Scanning systems
- IR, green or UV laser
- Continuous laser pulse fs
Surface condition of the substrate maintained also after ablation
Materials used for selective ablation:
- Conductive layer on glass or polymer
- Semiconductor on metal
- Polymer on glass
- Metal on glass or polymer
- Silicone on metal or glass
Areas of application
- Optoelectronic device
- Thin film photovoltaics
- Injection mould cleaning
Associated products or services
Etching - Controlled ablationLaser engraving is carried out by removing material layer by layer to obtain a 2D or 3D effect on all material types.
Laser shock peeningShock waves (> GPa) applied to metallic materials improve their fatigue resistance and their resistance to corrosion.
Machining of transparent materialsCutting, welding, drilling and engraving of transparent materials with minimization of mechanical stress. Short or ultra-short pulse lasers allow transparent materials to be machined with or without removal of material and to modify their intra-volume physical properties.
Laser drillingLaser drilling makes it possible to create through or blind holes with variable shape and high aspect ratio, on all types of materials and thicknesses.
Laser cuttingLaser cutting enables precision part production of all material types, even of transparent and hard materials such as SIC and diamond.
Surface texturingLaser texturing and surface functionalization make it possible to create effects or generate new properties on all surface types.